دانلود کتاب More-than-Moore 2.5D and 3D SiP Integration

Name: More-than-Moore 2.5D and 3D SiP Integration
Availability: InStock
Author: Riko Radojcic (auth.)
ISBN: 9783319525471,9783319525488

by Riko Radojcic (auth.)

عنوان فارسی: Integration بیش از Moore 2.5D و 3D SiP
ناشر: Springer International Publishing
سال: 2017
ویرایش: 1
زبان: انگلیسی
تعداد صفحه (نسخه چاپی - نسخه الکترونیکی): XV, 182-19
شابک: 9783319525471,9783319525488
نوع فایل: PDF دانلود نرم افزار مطالعه
حجم: 6.59 مگابایت

گزارش تخلف

دانلود کتاب

افزودن خلاصه فارسی

جزییات کتاب

This book presents a realistic and a holistic review of the microelectronic and semiconductor technology options in the post Moore’s Law regime. Technical tradeoffs, from architecture down to manufacturing processes, associated with the 2.5D and 3D integration technologies, as well as the business and product management considerations encountered when faced by disruptive technology options, are presented. Coverage includes a discussion of Integrated Device Manufacturer (IDM) vs Fabless, vs Foundry, and Outsourced Assembly and Test (OSAT) barriers to implementation of disruptive technology options. This book is a must-read for any IC product team that is considering getting off the Moore’s Law track, and leveraging some of the More-than-Moore technology options for their next microelectronic product.

کتاب های مرتبط

این کتاب رو مطالعه کردید؟ نظر شما چیست؟

برای ارسال نظر، لطفا وارد شوید.

نظر دهید

Adding comments has been disabled.

نظرات (0)

هنوز نظری داده نشده است. شما اولین باشید!