دانلود کتاب Design-for-Test and Test Optimization Techniques for TSV-based 3D Stacked ICs

Name: Design-for-Test and Test Optimization Techniques for TSV-based 3D Stacked ICs
Availability: InStock
Author: Brandon Noia
ISBN: 9783319023779, 9783319023786

by Brandon Noia, Krishnendu Chakrabarty (auth.)

عنوان فارسی: طراحی برای -test و تکنیک های بهینه سازی برای بر TSV- 3D انباشته IC های
ناشر: Springer International Publishing
سال: 2014
ویرایش: 1
زبان: انگلیسی
تعداد صفحه (نسخه چاپی - نسخه الکترونیکی): 245-260
شابک: 9783319023779, 9783319023786
نوع فایل: PDF دانلود نرم افزار مطالعه
حجم: 7.00 مگابایت

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جزییات کتاب

This book describes innovative techniques to address the testing needs of 3D stacked integrated circuits (ICs) that utilize through-silicon-vias (TSVs) as vertical interconnects. The authors identify the key challenges facing 3D IC testing and present results that have emerged from cutting-edge research in this domain. Coverage includes topics ranging from die-level wrappers, self-test circuits, and TSV probing to test-architecture design, test scheduling, and optimization. Readers will benefit from an in-depth look at test-technology solutions that are needed to make 3D ICs a reality and commercially viable.