دانلود کتاب 3D IC Devices, Technologies, and Manufacturing

The process of scaling integrated circuit (IC) chips has become more challenging as the feature size has been pushed into nanometer-technology nodes. In order to extend the scaling, engineers and scientists have attempted to not only shrink the feature size in x and y directions but also push IC devices into the third dimension. This book discusses the advantages of 3D devices and their applications in dynamic random access memory (DRAM), 3D-NAND flash, and advanced-technology-node CMOS ICs. Topics include the development of DRAM cell transistors and storage node capacitors the manufacturing process of advanced buried-word-line DRAM 3D FinFET CMOS IC devices scaling trends of CMOS logic devices that may be used in the «post-CMOS» era and 3D technologies, such as the 3D-wafer process integration of silicon-on-ILD and TSV-based 3D packaging.