دانلود کتاب Modern Electroplating, Fifth Edition

The definitive resource for electroplating, now completely up to dateWith advances in information-age technologies, the field of electroplating has seen dramatic growth in the decade since the previous edition of Modern Electroplating was published. This expanded new edition addresses these developments, providing a comprehensive, one-stop reference to the latest methods and applications of electroplating of metals, alloys, semiconductors, and conductive polymers. With special emphasis on electroplating and electrochemical plating in nanotechnologies, data storage, and medical applications, the Fifth Edition boasts vast amounts of new and revised material, unmatched in breadth and depth by any other book on the subject. It includes: Easily accessible, self-contained contributions by over thirty expertsFive completely new chapters and hundreds of additional pagesA cutting-edge look at applications in nanoelectronicsCoverage of the formation of nanoclusters and quantum dots using scanning tunneling microscopy (STM)An important discussion of the physical properties of metal thin filmsChapters devoted to methods, tools, control, and environmental issuesAnd much more A must-have for anyone in electroplating, including technicians, platers, plating researchers, and metal finishers, Modern Electroplating, Fifth Edition is also an excellent reference for electrical engineers and researchers in the automotive, data storage, and medical industries.Content: Chapter 1 Fundamental Considerations (pages 1–32): Milan Paunovic, Mordechay Schlesinger and Dexter D. SnyderChapter 2 Electrodeposition of Copper (pages 33–78): Jack W. Dini and Dexter D. SnyderChapter 3 Electrodeposition of Nickel (pages 79–114): George A. Di BariChapter 4 Electrodeposition of Gold (pages 115–130): Paul A. KohlChapter 5 Electroless and Electrodeposition of Silver (pages 131–138): Mordechay SchlesingerChapter 6 Tin and Tin Alloys for Lead?Free Solder (pages 139–204): Yun ZhangChapter 7 Electrodeposition of Chromium (pages 205–248): Nenad V. Mandich and Donald L. SnyderChapter 8 Electrodeposition of Lead and Lead Alloys (pages 249–263): Manfred JordanChapter 9 Electrodeposition of Tin–Lead Alloys (pages 265–284): Manfred JordanChapter 10 Electrodeposition of Zinc and Zinc Alloys (pages 285–307): Rene WinandChapter 11 Electrodeposition of Iron and Iron Alloys (pages 309–326): Masanobu IzakiChapter 12 Palladium Electroplating (pages 327–368): Joseph A. AbysChapter 13 Electrochemical Deposition Process for ULSI Interconnection Devices (pages 369–382): Tetsuya Osaka and Masahiro YoshinoChapter 14 Electrodeposition of Semiconductors (pages 383–411): T. E. Schlesinger, Krishnan Rajeshwar and Norma R. De TacconiChapter 15 Deposition on Nonconductors (pages 413–420): Mordechay SchlesingerChapter 16 Conductive Polymers: Electroplating of Organic Films (pages 421–432): Tetsuya Osaka, Shinichi Komaba and Toshiyuki MommaChapter 17 Electroless Deposition of Copper (pages 433–446): Milan PaunovicChapter 18 Electroless Deposition of Nickel (pages 447–458): Mordechay SchlesingerChapter 19 Electrochemical Synthesis of Metal Alloys for Magnetic Recording Systems (pages 459–476): Atsushi Sugiyama, Masahiro Yoshino, Takuma Hachisu and Tetsuya OsakaChapter 20 Electroless Deposition of Palladium and Platinum (pages 477–482): Izumi OhnoChapter 21 Electroless Deposition of Gold (pages 483–498): Yutaka Okinaka and Masaru KatoChapter 22 Electroless Deposition of Alloys (pages 499–506): Izumi OhnoChapter 23 Preparation for Deposition (pages 507–512): Dexter D. SnyderChapter 24 Manufacturing Tools (pages 513–526): Tom RitzdorfChapter 25 Monitoring and Control (pages 527–554): Tom RitzdorfChapter 26 Environmental Aspects of Electrodeposition (pages 555–571): Micha TomkiewiczChapter 27 Applications to Magnetic Recording and Microelectronic Technologies (pages 573–615): Stanko R. Brankovic, Natasa Vasiljevic and Nikolay DimitrovChapter 28 Microelectromechanical Systems (pages 617–636): Giovanni ZangariChapter 29 Analysis of Electroplated Films Using Dual?Beam FIB/SEM and TEM Techniques (pages 637–663): Xianying Meng?BuranyChapter 30 Ionic Liquid Treatments for Enhanced Corrosion Resistance of Magnesium?Based Substrates (pages 665–686): Robert Petro, Mordechay Schlesinger and Guang?Ling Song