دانلود کتاب Wireless Interface Technologies for 3D IC and Module Integration

Name: Wireless Interface Technologies for 3D IC and Module Integration
Availability: InStock
Author: Tadahiro Kuroda
ISBN: 110884121X,9781108841214

by Tadahiro Kuroda, Wai-Yeung Yip

عنوان فارسی: فناوریهای رابط بیسیم برای IC سه بعدی و یکپارچهسازی ماژول
ناشر: Cambridge University Press
سال: 2021
ویرایش: 1
زبان: انگلیسی
تعداد صفحه (نسخه چاپی - نسخه الکترونیکی): 300-338
شابک: 110884121X,9781108841214
نوع فایل: PDF دانلود نرم افزار مطالعه
حجم: 33.52 مگابایت

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جزییات کتاب

Synthesising fifteen years of research, this authoritative text provides a comprehensive treatment of two major technologies for wireless chip and module interface design, covering technology fundamentals, design considerations and tradeoffs, practical implementation considerations, and discussion of practical applications in neural network, reconfigurable processors, and stacked SRAM. It explains the design principles and applications of two near-field wireless interface technologies for 2.5-3D IC and module integration respectively, and describes system-level performance benefits, making this an essential resource for researchers, professional engineers and graduate students performing research in next-generation wireless chip and module interface design.