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Erdogan Madenci Ibrahim Guven Bahattin Kilic (auth.)
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دانلود کتاب Fatigue Life Prediction of Solder Joints in Electronic Packages with Ansys®
by Erdogan Madenci, Ibrahim Guven, Bahattin Kilic (auth.)|
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عنوان فارسی: پیش بینی عمر خستگی از لحیم اتصالات در بسته الکترونیکی با Ansys® |
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جزییات کتاب
Fatigue Life Prediction of Solder Joints in Electronic Packages with ANSYS® describes the method in great detail starting from the theoretical basis. The reader is supplied with an add-on software package to ANSYS® that is designed for solder joint fatigue reliability analysis of electronic packages. Specific steps of the analysis method are discussed through examples without leaving any room for confusion. The add-on package along with the examples make it possible for an engineer with a working knowledge of ANSYS® to perform solder joint reliability analysis. Fatigue Life Prediction of Solder Joints in Electronic Packages with ANSYS® allows the engineers to conduct fatigue reliability analysis of solder joints in electronic packages.
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