دانلود کتاب Chiplet Design and Heterogeneous Integration Packaging

Name: Chiplet Design and Heterogeneous Integration Packaging
Availability: InStock
Author: John H. Lau
ISBN: 9811999163,9789811999161

by John H. Lau

عنوان فارسی: طراحی تراشه و بسته بندی ادغام ناهمگن
ناشر: Springer
سال: 2023
زبان: انگلیسی
تعداد صفحه (نسخه چاپی - نسخه الکترونیکی): 541-542
شابک: 9811999163,9789811999161
نوع فایل: PDF دانلود نرم افزار مطالعه
حجم: 30.19 مگابایت

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جزییات کتاب

The book focuses on the design, materials, process, fabrication, and reliability of chiplet design and heterogeneous integraton packaging. Both principles and engineering practice have been addressed, with more weight placed on engineering practice. This is achieved by providing in-depth study on a number of major topics such as chip partitioning, chip splitting, multiple system and heterogeneous integration with TSV-interposers, multiple system and heterogeneous integration with TSV-less interposers, chiplets lateral communication, system-in-package, fan-out wafer/panel-level packaging, and various Cu-Cu hybrid bonding. The book can benefit researchers, engineers, and graduate students in fields of electrical engineering, mechanical engineering, materials sciences, and industry engineering, etc.

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