دانلود کتاب Electromigration Modeling at Circuit Layout Level

Name: Electromigration Modeling at Circuit Layout Level
Availability: InStock
Author: Cher Ming Tan
ISBN: 9814451207,9789814451208

by Cher Ming Tan, Feifei He

عنوان فارسی: مدلسازی مهاجرت الکتریکی در سطح طرحبندی مدار
ناشر: Springer
سال: 2013
ویرایش: 2013
زبان: انگلیسی
تعداد صفحه (نسخه چاپی - نسخه الکترونیکی): 112-110
شابک: 9814451207,9789814451208
نوع فایل: PDF دانلود نرم افزار مطالعه
حجم: 4.91 مگابایت

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جزییات کتاب

Integrated circuit (IC) reliability is of increasing concern in present-day IC technology where the interconnect failures significantly increases the failure rate for ICs with decreasing interconnect dimension and increasing number of interconnect levels. Electromigration (EM) of interconnects has now become the dominant failure mechanism that determines the circuit reliability. This brief addresses the readers to the necessity of 3D real circuit modelling in order to evaluate the EM of interconnect system in ICs, and how they can create such models for their own applications. A 3-dimensional (3D) electro-thermo-structural model as opposed to the conventional current density based 2-dimensional (2D) models is presented at circuit-layout level.