دانلود کتاب Design and Modeling for 3DICs and Interposers

Name: Design and Modeling for 3DICs and Interposers
Availability: InStock
Author: Madhavan Swaminathan
ISBN: 9814508594, 9789814508599

by Madhavan Swaminathan

عنوان فارسی: طراحی و مدل سازی برای 3DICs و Interposers
ناشر: World Scientific Publishing Company
سال: 2014
زبان: انگلیسی
تعداد صفحه (نسخه چاپی - نسخه الکترونیکی): 380
شابک: 9814508594, 9789814508599
نوع فایل: PDF دانلود نرم افزار مطالعه
حجم: 34.00 مگابایت

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جزییات کتاب

3D Integration is being touted as the next semiconductor revolution. This book provides a comprehensive coverage on the design and modeling aspects of 3D integration, in particularly, focus on its electrical behavior. Looking from the perspective the Silicon Via (TSV) and Glass Via (TGV) technology, the book introduces 3DICs and Interposers as a technology, and presents its application in numerical modeling, signal integrity, power integrity and thermal integrity. The authors underscored the potential of this technology in design exchange formats and power distribution. Readership: Graduate students, academics, researchers in electrical and electronics engineering, computer engineering, semiconductors and packaging.

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