دانلود کتاب Handbook of Cleaning in Semiconductor Manufacturing: Fundamental and Applications

This comprehensive volume provides an in-depth discussion of the fundamentals of cleaning and surface conditioning of semiconductor applications such as high-k/metal gate cleaning, copper/low-k cleaning, high dose implant stripping, and silicon and SiGe passivation. The theory and fundamental physics associated with wet etching and wet cleaning is reviewed, plus the surface and colloidal aspects of wet processing. Formulation development practices and methodology are presented along with the applications for preventing copper corrosion, cleaning aluminum lines, and other sensitive layers. This is a must-have reference for any engineer or manager associated with using or supplying cleaning and contamination free technologies for semiconductor manufacturing. From the Reviews... "This handbook will be a valuable resource for many academic libraries. Many engineering librarians who work with a variety of programs (including, but not limited to Materials Engineering) should include this work in their collection. My recommendation is to add this work to any collection that serves a campus with a materials/manufacturing/electrical/computer engineering programs and campuses with departments of physics and/or chemistry with large graduate-level enrollment." —Randy Wallace, Department Head, Discovery Park Library, University of North TexasContent: Chapter 1 Surface and Colloidal Chemical Aspects of Wet Cleaning (pages 1–36): Srini Raghavan, Manish Keswani and Nandini VenkataramanChapter 2 The Chemistry of Wet Cleaning (pages 39–94): D. Martin KnotterChapter 3 The Chemistry of Wet Etching (pages 95–141): D. Martin KnotterChapter 4 Surface Phenomena: Rinsing and Drying (pages 143–168): Karen A. Reinhardt, Richard F. Reidy and John A. MarsellaChapter 5 Fundamental Design of Chemical Formulations (pages 169–192): Robert J. Rovito, Michael B. Korzenski, Ping Jiang and Karen A. ReinhardtChapter 6 Filtering, Recirculating, Reuse, and Recycling of Chemicals (pages 193–236): Barry Gotlinsky, Kevin T. Pate and Donald C. GrantChapter 7 Cleaning Challenges of High??/Metal Gate Structures (pages 237–284): Muhammad M. Hussain, Denis Shamiryan, Vasile Paraschiv, Kenichi Sano and Karen A. ReinhardtChapter 8 High Dose Implant Stripping (pages 285–325): Karen A. Reinhardt and Michael B. KorzenskiChapter 9 Aluminum Interconnect Cleaning and Drying (pages 327–354): David J. MaloneyChapter 10 Low??/Cu Cleaning and Drying (pages 355–394): Karen A. Reinhardt, Richard F. Reidy and Jerome DaviotChapter 11 Corrosion and Passivation of Copper (pages 395–428): Darryl W. PetersChapter 12 Germanium Surface Conditioning and Passivation (pages 429–472): Sonja Sioncke, Yves J. Chabal and Martin M. FrankChapter 13 Wafer Reclaim (pages 473–500): Michael B. Korzenski and Ping JiangChapter 14 Direct Wafer Bonding Surface Conditioning (pages 501–541): Hubert Moriceau, Yannick C. Le Tiec, Frank Fournel, Ludovic F. L. Ecarnot, Sebastien L. E. Kerdiles, Daniel Delprat and Christophe MalevilleChapter 15 Novel Analytical Methods for Cleaning Evaluation (pages 543–564): Chris M. Sparks and Alain C. DieboldChapter 16 Stripping and Cleaning for Advanced Photolithography Applications (pages 565–583): John A. Marsella, Dana L. Durham and Leslie D. Molnar