جزییات کتاب
This book includes much cutting-edge material. Entirely new chapters on contamination and contamination control describe the basics and the issues - as feature sizes shrink to sub-micron dimensions, cleanliness and particle elimination has to keep pace. A new chapter on meterology explains the growth of sophisticated, automatic tools capable of measuring thickness and spacing of sub-micron dimensions. The book also covers PVD, laser and e-beam assisted deposition, MBE, and ion beam methods to bring together all the physical vapor deposition techniques. Two entirely new areas receive full treatment: chemical mechanical polishing, which helps attain the flatness that is required by modern lithography methods, and new materials used for interconnect dielectric materials, specifically organic polyimide materials.