دانلود کتاب Adhesives Technology for Electronic Applications: Materials, Processing, Reliability

Name: Adhesives Technology for Electronic Applications: Materials, Processing, Reliability
Availability: InStock
Author: James J. Licari
ISBN: 0815515138, 9780815515135, 9780815516002

by James J. Licari, Dale W. Swanson

عنوان فارسی: فناوری چسب برای کاربردهای الکترونیکی : مواد، پردازش ، قابلیت اطمینان
ناشر: William Andrew
سال: 2007
ویرایش: 1st
زبان: انگلیسی
تعداد صفحه (نسخه چاپی - نسخه الکترونیکی): 480-480
شابک: 0815515138, 9780815515135, 9780815516002
نوع فایل: PDF دانلود نرم افزار مطالعه
حجم: 4.00 مگابایت

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جزییات کتاب

This book is unique in its comprehensive coverage of all aspects of adhesive technology for microelectronic devices and packaging, from theory to bonding to test procedures. In addition to general applications, such as dies, substrate, and lid and chip stack attachments, the book includes new developments in anisotropic, electrically conductive, and underfill adhesives. Rapid curing methods such as UV, microwave, and moisture (which comply with current environmental and energy requirements) are covered. Over 80 tables and 120 figures provide a wealth of data on properties, performance, and reliability. Also included are examples of commercially available adhesives, suppliers, and equipment. Each chapter provides comprehensive references.