دانلود کتاب Cofire Technology: Ceramic Engineering and Science Proceedings, Volume 9, Issue 11/12

This volume is part of the Ceramic Engineering and Science Proceeding  (CESP) series.  This series contains a collection of papers dealing with issues in both traditional ceramics (i.e., glass, whitewares, refractories, and porcelain enamel) and advanced ceramics. Topics covered in the area of advanced ceramic include bioceramics, nanomaterials, composites, solid oxide fuel cells, mechanical properties and structural design, advanced ceramic coatings, ceramic armor, porous ceramics, and more.Content: Chapter 1 Multichip Module Technology (pages 1549–1566): D. R. BarbourChapter 1 Low Dielectric Constant, Alumina?Compatible, Co?Fired Multilayer Substrate (pages 1567–1578): Douglas M. Mattox, Stephen R. Gurkovich, John A. Olenick and Keith M. MasonChapter 1 Filling the Gap between Thick and Thin Film (pages 1579–1589): R. A. Rinne and H. L. FritzChapter 1 Electrical, Mechanical, and Thermal Characterization of a Cofired, Multilayer Substrate Processed from Sol?Gel Silica (pages 1590–1602): L. E. SanchezChapter 1 Materials Compatibility and Co?Sintering Aspects in Low Temperature Co?Fired Ceramic Packages (pages 1603–1617): Howard T. SawhillChapter 1 Advantages of Co?Fired Multilayer over Thick Film Technology (pages 1618–1628): K. K. Verma