دانلود کتاب 3D Stacked Chips: From Emerging Processes to Heterogeneous Systems

Name: 3D Stacked Chips: From Emerging Processes to Heterogeneous Systems
Availability: InStock
Author: Ibrahim (Abe) M. Elfadel
ISBN: 9783319204802, 9783319204819

by Ibrahim (Abe) M. Elfadel, Gerhard Fettweis (eds.)

عنوان فارسی: 3D انباشته چیپس : از فرآیندهای در حال ظهور به سیستم های ناهمگن
ناشر: Springer International Publishing
سال: 2016
ویرایش: 1
زبان: انگلیسی
تعداد صفحه (نسخه چاپی - نسخه الکترونیکی): XXIII, 339
شابک: 9783319204802, 9783319204819
نوع فایل: PDF دانلود نرم افزار مطالعه
حجم: 16.00 مگابایت

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This book explains for readers how 3D chip stacks promise to increase the level of on-chip integration, and to design new heterogeneous semiconductor devices that combine chips of different integration technologies (incl. sensors) in a single package of the smallest possible size. The authors focus on heterogeneous 3D integration, addressing some of the most important challenges in this emerging technology, including contactless, optics-based, and carbon-nanotube-based 3D integration, as well as signal-integrity and thermal management issues in copper-based 3D integration. Coverage also includes the 3D heterogeneous integration of power sources, photonic devices, and non-volatile memories based on new materials systems.