دانلود کتاب Testing of Interposer-Based 2.5D Integrated Circuits

Name: Testing of Interposer-Based 2.5D Integrated Circuits
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Author: Ran Wang and Krishnendu Chakrabarty

by Ran Wang and Krishnendu Chakrabarty

عنوان فارسی: تست Interposer مبتنی بر 2.5 D مدارات مجتمع
ناشر: Springer
سال: 2017
زبان: انگلیسی
تعداد صفحه (نسخه چاپی - نسخه الکترونیکی): 192
نوع فایل: PDF دانلود نرم افزار مطالعه
حجم: 12.52 مگابایت

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جزییات کتاب

This book provides readers with an insightful guide to the design, testing and optimization of 2.5D integrated circuits. The authors describe a set of design-for-test methods to address various challenges posed by the new generation of 2.5D ICs, including pre-bond testing of the silicon interposer, at-speed interconnect testing, built-in self-test architecture, extest scheduling, and a programmable method for low-power scan shift in SoC dies. This book covers many testing techniques that have already been used in mainstream semiconductor companies. Readers will benefit from an in-depth look at test-technology solutions that are needed to make 2.5D ICs a reality and commercially viable.

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